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grinding process in mems

grinding process in mems

Jari Mäkinen Tommi Suni in Handbook of Silicon Based MEMS Materials and Technologies Second Edition 2015 7432 Crystal Defects Film quality and crystalline perfection of SOI layers obtained by direct bonding and mechanical grinding and polishing techniques are virtually identical to those of device grade bulk silicon wafers If the polishing is performed to prime grade standards the [email protected]
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